The future of AI isn’t coming; it’s already here. With NVIDIA’s recent announcement of forthcoming 600kW+ racks, alongside the skyrocketing power costs of inference-based AI workloads, now’s the time to assess whether your data center is equipped to meet these demands.

Fortunately, two-phase direct-to-chip liquid cooling is prepared to empower today’s AI boom—and accommodate the next few generations of high-powered CPUs and GPUs. Join Accelsius CEO Josh Claman and CTO Dr. Richard Bonner as they walk through the ways in which their NeuCool™ 2P D2C technology can safely and sustainably cool your data center.

During the webinar, Accelsius leadership will illustrate how NeuCool can reduce energy savings by up to 50% vs. traditional air cooling, drastically slash operational overhead vs. single-phase direct-to-chip, and protect your critical infrastructure from any leak-related risks. While other popular liquid cooling methods carry require constant oversight or designer fluids to maintain peak performance, two-phase direct-to-chip technologies require less maintenance and lower flow rates to achieve better results.

Beyond a thorough overview of NeuCool, viewers will take away these critical insights:

• The deployment of Accelsius’ Co-Innovation Labs—global hubs enabling data center leaders to witness NeuCool’s thermal performance capabilities in real-world settings
• Our recent testing at 4500W of heat capture—the industry record for direct-to-chip liquid cooling
• How Accelsius has prioritized resilience and stability in the midst of global supply chain uncertainty
• Our upcoming launch of a multi-rack solution able to cool 250kW across up to four racks

Be sure to join us to discover how two-phase direct-to-chip cooling is enabling the next era of AI.