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3D IC

3D IC

By: Siemens Digital Industries Software
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 As the semiconductor industry struggles with the limits of Moore’s Law, traditional monolithic scaling is no longer enough to meet performance, power, area and cost demands in technology, design, analysis, and manufacturing. 3D IC by Siemens is your go-to podcast for exploring the cutting-edge world of 3D IC packaging—a revolutionary approach reshaping semiconductor design, system integration, and heterogeneous computing. Join industry leaders, engineers, and innovators as we break down advanced IC packaging solutions like 2.5D/3D IC, FCBGA, FOWLP, and more. Discover how chiplets, multi-die integration, and high-bandwidth memory (HBM) are driving higher performance, lower power consumption, and scalable architectures. In each episode, we dive deep into the challenges and opportunities of IC design and manufacturing, including: Roadmap for advanced packaging and heterogeneous integration in semiconductor scaling Mainstream adoption of 3D IC—key challenges and breakthroughs Optimizing micro-architecture and integration platforms for performance and efficiency Strategic planning of chiplets and interposers for hierarchical device integration Leveraging early predictive multi-physics analysis to enhance design accuracy Automating design and routing for RDL-based fan-out wafer-level packaging (FOWLP) Exploring glass substrates for superior electrical and thermal performance Developing test-vehicles and daisy chain designs for architectural validation Ensuring reliability and manufacturability in 3D IC heterogeneous integration Mastering Signal Integrity (SI) and Power Integrity (PI) Analysis for high-speed systems Managing thermal challenges in stacked die architectures Subscribe now and stay ahead in the world of 3D IC. Learn more: Siemens 3D IC Packaging SolutionsSiemens Digital Industries Software Politics & Government
Episodes
  • Why 3D ICs Need a Mindset Shift—and How to Make It Happen

    Why 3D ICs Need a Mindset Shift—and How to Make It Happen
    Jul 10 2025
    What does it take to turn 3D IC from a buzzword into a successful reality, and how early should you start thinking about system-level planning? Get practical insight into why system-level planning is essential from day one of your 3D IC project. You’ll learn how to avoid costly design iterations, streamline collaboration across domains, and accelerate time to market with co-design and early simulation strategies. In this episode of the Siemens 3D IC podcast, host John McMillan sits down with Tony Mastroianni, Advanced Packaging Solutions Director at Siemens EDA. With decades of experience in design, integration, and manufacturing, Tony shares why system-level planning is a critical first step, not an afterthought, when tackling 3D IC projects. They unpack the common pitfalls of treating package design as isolated from system goals and how the shift from chip-centric to system-centric thinking can redefine success in high-density, high-performance integration. Tony also discusses the value of co-design, early simulation, and cross-disciplinary collaboration to reduce iterations, control cost, and accelerate time to market. If you're involved in semiconductors, EDA tools, IC packaging, or advanced integration, this episode offers clear, actionable insight into the future of electronics design. Recommended for: System architects, IC designers, semiconductor packaging engineers, EDA tool users, design managers, and anyone working on or interested in 3D IC implementation. What You’ll Learn in this Episode: From a dozen transistors per chip to trillions: What 30 years in the industry can teach you. (1:32) How to realize that 3D IC workflows must change within a company. (5:50) What type of resistance can be expected when implementing design or workflow changes? (07:00) What internal changes are required better to address the cross-disciplinary demands of 3D IC system design? (9:30) Final thoughts (23:00) Connect with John McMillan LinkedIn Website Connect with Tony Mastroianni LinkedIn Website As mentioned during the show: Episode 1: An Introduction to 3D IC https://blogs.sw.siemens.com/podcasts/3d-ic/an-introduction-to-3d-ic-ep-1/
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    26 mins
  • The Hidden Heat Challenge of 3D ICs—and What Designers Need to Know

    The Hidden Heat Challenge of 3D ICs—and What Designers Need to Know
    Jun 26 2025
    Why is thermal analysis no longer an afterthought in 3D IC design—and what is Siemens doing to empower engineers across every step of the process? In this episode of the Siemens EDA Podcast Series on 3D IC chiplet ecosystems, host John McMillan welcomes András Vass-Varnai, 3DIC Solutions Engineer at Siemens Digital Industries, to spotlight one of the most critical (and often underestimated) challenges in modern chip design: thermal analysis. As power densities soar and chiplets stack closer together than ever before, effective thermal management is essential—not just for performance, but for reliability, lifespan, and product feasibility. András explores how Siemens is bridging the gap between design, packaging, and thermal engineering through integrated toolchains and a new generation of digital twins. Whether you're a silicon designer, package architect, or thermal analyst, this episode offers valuable insights into the future of collaborative thermal modeling, IP protection, and real-time simulation integration. What You’ll Learn in this Episode: Andrass Vass-Varnai’s background and current role at Siemens EDA (1:25) How is the shift to 3D IC packaging affecting thermal analysis? (2:35) What is the issue with the current approach to thermal analysis? (4:20) What is the significance of having thermal models for the customers? (6:50) Siemens' vision for the ideal future workflow (11:00) Conclusion and future outlook (17:00) Connect with John McMillan LinkedIn Website Connect with Andras Vass-Varnai LinkedIn Website
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    18 mins
  • Why Traditional PCB Methods Fall Short in 3D IC Design

    Why Traditional PCB Methods Fall Short in 3D IC Design
    Jun 12 2025
    Why are companies rapidly adopting fan-out wafer-level packaging (FO-WLP)—and how does this shift impact the traditional chip design process? In this episode of the Siemens 3D IC Podcast Series, host John McMillan is joined by Chris Cone, IC Packaging Product Marketing Manager at Siemens EDA, to explore how fan-out wafer-level packaging is transforming advanced semiconductor packaging workflows. Chris shares his journey from analog design engineer to packaging and automation expert, and breaks down the growing need for intelligent, automated workflows that support the increasing complexity and size of modern designs. They discuss how new IC packaging techniques demand more automation, design iteration, and cross-functional collaboration than ever before—and why building a replayable, flexible automation language is the key to faster, scalable design success. Whether you're a layout engineer, SI/PI analyst, or replay coordinator, this episode will show you how to streamline your process using a common design framework and why human-readable automation is the next big leap in fan-out design. What You’ll Learn in this Episode: Chris Cone’s journey from analog IC designer to Siemens EDA packaging lead (1:10) What is fan-out wafer-level packaging, and why is it gaining traction? (1:50) How FOWLP is different than a traditional BGA design process (2:30) The four major phases in a fan-out packaging workflow, from tech setup to final verification (3:45) What is the impact on different roles, such as a package designer, layout designer, engineer, signal integrity, power, and integrity analysis? (8:00) The three essential traits of successful design automation (10:00) Key takeaways from real-world projects using Siemens’ automated packaging flows (11:45) Connect with John McMillan LinkedIn Website Connect with Chris Cone Website
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    13 mins

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