While at least a dozen companies offer excellent solutions to deliver the ultra-high currents required to power modern GPUs, Ferric developed a unique capability to integrate thin-film magnetic power inductors within their devices’ packages that eliminates the need for bulky external components. As a result, they can create chip-scale power converters that integrate interface, telemetry, feedback control, and powertrain circuitry.

In this episode of Inside Electronics, Noah Sturken sits down with James Morra, senior editor at Electronic Design, to discuss what’s wrong with how AI processors are powered today and how he hopes to tackle technical challenges with Ferric’s IVRs.

There are all kinds of virtual machines (VM) available and many are being employed in embedded applications. Platforms like the Java virtual machine (JVM) are used on servers and embedded applications with features like garbage collection. Unfortunately, these can have a lot of overhead making them less desirable for small, microcontroller-based systems. Rolf Segger, Founder of Segger Microcontroller Systems, talks about the company's new emApps virtual platform.

The cloud and IoT are growing and expanding in complexity in a variety of ways as the core technologies behind the devices and related infrastructure evolve and mature. In this episode, we talk to Nebu Philips, Senior Director, Strategy & Business Development at Synaptics, about where we are and where we want to go with edge computing, AI, and the Cloud.

IoT empowers intelligent machines to provide advanced functionality to society, but it isn’t easy to get there from here. Key aspects of development include the importance of creating tools that empower others, the role of the market ecosystems in driving adoption, and the challenges in the infrastructure needed to bring connected technologies to the market. We talk to Alistair Fulton, CEO of IoT Labs, about the future of the marketplace

Industrial subsystems are distributed so communication between these subsystems needs to preserve this information and deliver it in a timely fashion. This is where time sensitive networking (TSN) comes into play. We talk to Mark Geisler, Marketing Manager at Analog Devices, about the future of TSN in plug-and-play industrial networks as well as the technical and organizational challenges that engineers face when incorporating TSN into their systems.

The PCI-SIG PCI Express Gen 7 standard is now available but work has not stopped there. PCIe Gen 8 is on the horizon and with a planned doubling of the bandwidth to 256 GT/s. This will be challenging from a number of perspectives from support copper connections at this speed to advancements in the protocol.

In this episode, Electronic Design talks to Karl Wachswender, Senior Principal System Architect at Lattice Semiconductor. Lattice is well known for its power efficient FPGAs that support artificial intelligence (AI) applications. They also address post-quantum cryptography, and are found in demanding applications like automotive.

Nanusens creates nanoscale sensor structures inside the CMOS layers using standard CMOS processes within the same production flow as making the control electronics on the same chip. This approach reduces the size and cost as it benefits from the vast economies of scale of using giant CMOS fabs. The resulting single chip solution has a packaged size of 0.5 mm³. This episode delves into the technology, its future, and some limitations.