Designing a device that incorporates AI can be daunting, for a good reason—it’s very complex. When you push that design out to the Edge, it brings in even more challenges, both on the hardware and software sides of the equation.

To understand what these challenges are and where a designer can turn for help, I spoke to Amir Panush, the CEO of CEVA, on this week’s Embedded Executives podcast. He addresses these issues on a regular basis and has a good understanding of what a designer needs to know.

Silicon Labs recently announced an MCU that has achieved the highest level of security possible to date, which is PSA Level 4. The questions you may be asking are, “What does that mean, and is this something I need to understand?”

To get answers to these questions and many related ones, I spoke to Sharon Hagi, the Chief Security Officer at Silicon Labs, on this week’s Embedded Executives podcast. You may be surprised by his responses, that not every design needs this level of security.

We’re in the era of quantum computing. That brings with it a lot of great things. But at the same time, it brings some not so good things. Once again, we’re in a race to stay ahead of the bad guys to keep our systems secure.

Folks like the experts at Infineon are doing what they can to do just that. And the best part is that they are trying to insulate their customers from having to deal with all the different measures that must be put in place.

Hear from Eric Wood, Infineon’s Senior Director of Microcontroller Cryptography and Product Security, to see if this sounds like a fit for your design. Check out this week’s Embedded Executives podcast to learn more.

The boom coming from AI is requiring data centers to be built as fast as we can build them. To that end, there is a lot of discussion about the power that’s needed to drive these data centers. What there’s not a lot of discussion about are the interconnects that are used within these power-hungry computing camps. And that’s the specialty of Point2 Technology, a fairly new company that boasts ultra-low power interconnect solutions.

To understand how the company’s technology works, I spoke to Sean Park, Point2’s President, CEO, and Founder, on this week’s Embedded Executives podcast.

For as long as we’ve been designing embedded computers and consumer electronics, we’ve had a problem figuring out how to handle the heat that’s created. Known as thermal management, the problem seems omnipresent as systems become more compact, processors run faster, and so on.

Unfortunately, many designers don’t think about thermal management until it’s too late in the design process, which further exacerbates the problem. So what’s a developer to do? That’s what I asked Carl Schlachte, the President and CEO of Ventiva, who specializes in this technology, in this week’s Embedded Executives podcast.

While it may not be as intimidating as it once was, antenna design can still be a make-or-break aspect of your end product. Make the antenna too big, and the end users balk. Make the antenna too small, and the device won’t function properly (and end users will balk).

To understand where and how the antenna design should begin, I spoke with Dermot O'Shea, the CEO of Taoglas, an expert in antenna design and certification, on this week’s Embedded Executives podcast.

TSMC recently announced its exit from the GaN space. Well, maybe “announced” is the wrong word, but they did let customers know that they will not be producing GaN devices going forward.

Details are still coming out, so we don’t know exactly when that stoppage will occur. So what does that mean for TSMC partners who relied on them to produce their products?

To understand what that means, I spoke to Johannes Schoiswohl, the Senior Vice President and General Manager of Infineon’s GaN Business Line. Infineon may have an easier time than others making this transition, but it’s an interesting time nonetheless. Check out this week’s Embedded Executives podcast to learn more.

Compute in the automobile is (again) moving toward consolidation and away from the discrete nature of multiple processors around the vehicle. Is this a trend that’s going to stick? I guess it depends on who you ask.

In this case, I asked Robert Moran, the GM & VP for Automotive Processors at NXP Semiconductors. As we add AI and autonomous drive to the software-defined vehicle (SDV), a move like this is pretty much a requirement. Hear it right from the horse’s mouth on this week’s Embedded Executives podcast.